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he Contamet process is a direct metallization process based on tin/palladium colloids which are adsorbed to the surface. Subsequently the conductive layer is enforced by Cu-particles, giving a superior conductivity for acid copper plating. Contamet process is available for vertical and horizontal system.

 
  直接金屬化制程 — Contamet ; 使用錫鈀膠體系統(tǒng), 膠體能均勻吸附于孔內(nèi)非導(dǎo)電層而型成導(dǎo)電膜. 同時(shí)以銅做為連結(jié), 大幅提高導(dǎo)電膜之導(dǎo)電度, 有助于后續(xù)電鍍銅之均勻覆蓋. Contamet制程適用于垂直或水平設(shè)備.